Disco-DFL7560L
Disco DFL7560L 是由日本 DISCO Corporation 研发的一款 全自动激光剥离（Laser Lift-Off）设备，用于半导体晶圆的材料层与基板分离等精密加工工艺。它采用 DPSS（固体激光）激光源，在保证高加工质量的同时实现高速处理与稳定重复性。
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Disco DFL7560L 是由日本 DISCO Corporation 研发的一款 全自动激光剥离（Laser Lift-Off）设备，用于半导体晶圆的材料层与基板分离等精密加工工艺。它采用 DPSS（固体激光）激光源，在保证高加工质量的同时实现高速处理与稳定重复性。
Free shipping on orders over $50!
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